We offer the right base material for any application. Our material is characterized by high resistance and at the same time long-term durability at the brazing process. Short-term temperatures of almost 300 °C can be handled without any problems.
You will find further information on the data sheets. We will be pleased to advise you with your individual application.
The increasing pack density of components on both sides requires increasingly demanding soldering mask designs. There, the common composite material can reach its stability limit. As an alternative, titanium provides extreme resistance and at the same time very high abrasion resistance and insensitiveness against flux and solder for designs with and without SMD-pouch. To separate SMD from very closely located THT-solder joints titanium is (the?) first choice – thickness of up to 0.3 mm can be realized. The temperature connectivity to the circuit board is also considerably better when using titanium. Titanium inserts can be implemented in almost every soldering system.
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All the named base material can be finished with our ESD-suited coatings. This make longer service periods with better tin flows and reduced cleaning necessities. For soldering applications on composite basis, we offer the finish K10101. It has excellent surface properties.
Our P12201 is perfectly suited for coating application with aluminum carrier. The smooth and robust surface reduces the remnants of sticking paint – also persistent paint residues can be removed far easier.
Please ask for the appropriate finish for your application!